LS-fPRO – Customizable laser processing machine for high accuracy applications
LS-fPRO is a versatile workstation designed for high demanding laser processing applications where nanometer resolutions and laser spot sizes down to 1 micron are required.
The main heavy granite structure, with passive damping and advanced solutions like close loop surface measurement for automatic focus correction, provides extremely high accuracy and stability even for complex trajectories.
User friendly software with CAD GUI enviroment (codeless programming) ensure an efficient and fast process development.
Features:
- Fixed optic head with automatic objective´s change.
- High precision scan head.
- Automatic change from Fixed Head to Scanner setup.
- Co-lineal vision system with motorized optics.
- Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
- Automated camera calibration.
- Automated feature camera recognition for precision aligment and rotation compensation.
- Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files)
- Class 1 high end enclosure with automatic door and HMI panel.
Options:
- Multiple laser sources with automatic path change.
- Processing objectives from 50x to 4x for different wavelengths.
- F-Theta and telecentric lenses for scanner head up to 160 mm FL.
- Customized vacuum holder.
- Fast 3D module for Galvo and Fixed optic heads.
- Customized software for special applications.
Value | Specification |
---|---|
Working area | 300 x 100 x 100mm |
Resolution | 10nm (XY), 0.3um (Z) |
Repeatability | 40nm (XY), 0.5um (Z) |
Accuracy | 2.5um (XY), 2.5um (Z) |
Available laser sources | From UV to IR, pulsed and CW |
Substrate holder | 250 x 200mm aluminium vacuum plate |
Minimum laser spot | Typical 1um |
External dimensions | 1400 x 1500 x 2200mm (W x D x H) |
Weight | Aprox 1700kg without laser source |
Control unit | Workstation with dual 23” monitor |
Application notes (click to download):
- High quality metal engraving and cutting using femtosecond laser source
- High precision micrometer ITO removal solution for large areas
Datasheet (click to download):
LS-LAB – versatile, compact workstation for demanding laser processing
LS-LAB s a versatile, compact workstation designed for highly demanding laser processing applications where nanometer resolutions and laser spots sizes down to 1 micron are required.
Based on a compact aluminum and granite structure, LS-LAB provides high accuracy and stability at an affordable cost, integrating advanced solutions such as closed loop surface measurement for automatic focus correction. User friendly software with a CAD GUI environment (codeless programing)
ensures efficient and fast process development.
Features:
- Fixed optic head with automatic objective change.
- Collinear vision system with motorized optics.
- Collinear surface measurement laser system with closed-loop correction or 2D scanning option.
- Automated camera calibration.
- Automated camera-based feature recognition for precision alignment and rotation compensation.
- Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files)
- Class 1 enclosure.
Options:
- Multiple laser sources with automatic path change.
- Processing objectives from 50x to 4x for different wavelengths.
- Customized vacuum holder.
- Fast 3D module for fixed optic head.
- Customized software for special applications.
Value | Specification |
---|---|
Working area | 200 x 200 x 20mm |
Resolution | 20nm (XY), 0.1um (Z) |
Repeatability | 0.3um (XY), 0.1um (Z) |
Accuracy | 2.5um (XY), 1um (Z) |
Available laser sources | From UV to IR, pulsed and CW |
Substrate holder | 100 x 100mm aluminium vaccuum plate |
Minimum laser spot size | Typical from 1mm |
External dimensions | 1400 x 1750 x 2050mm (W x D x H) |
Weight | Aprox 600kg without laser source |
Control unit | Workstation with 23” monitor |
LS- MARK2D – Cost effective laser processing machine for 2.5D
LS-MARK2D is a versatile, compact workstation designed for 2.5D laser marking and engraving applications. Nanosecond pulsed laser sources up to 50W of average power in KHz regime and emission form IR to UV are integrated to optimize the material absorbtion. High precision and high speed 2D galvanometer plus motorized stage provide high flexibility at and affordable cost.
Additional options as motorized rotation stage, XY motorized table or parallel vision system are available for advanced applications. The user friendly software supports various vector and bitmap graphics, select processing variables, control position stages, add power compensation functions and automated procedures.
Options:
- XY motorized table:
- Stroke: 100mm x 100mm
- Resolution: 1um
- Repeatability: ± 2um
- Max. speed: 100m/s
- Rotation stage:
- Stroke 360°
- Resolution 0.05°
- Repeatability ±0.1°
- Fume extractor
- Filtering efficiency 0.3um, 99.9%
- Max air velocity 280 m3/h
Specification | Value |
---|---|
Maximum direct galvo working area with EFL 256mm | 70 x 175 x 60mm |
Maximum direct galvo working area with EFL 100mm | 70 x 70 x 180mm |
Resolution | 12 uRAD (XY) |
Repeatability | 12 uRAD (XY) |
Z stage resolution | 1um |
Z stage repeatability | ± 2.5um |
Max. marking speed | 5 m/s |
Min. spot size (1/e2) | IR < 30um, VIS < 15um, UV < 10um |
Max. laser power | IR < 50W, VIS < 4W, UV < 5W |
Max. ernergy / pulse | IR < 1mJ, VIS, < 200uJ, UV < 80 uJ |
External dimensions | 500 x 800 x 1400mm (W x D x H) |
Weight | Aprox. 150kg |
PC | Integrated with tactile screen |
Software file support | Image: BMP, JPG, PNG – Vector: AI, DXF, PIT |
Datasheet (click to download):